AI is not only expected to trigger a new industrial revolution, but also integrated into everyone’s daily life and is triggering social change. In April 2020, the National Development and Reform Commission determined three aspects of new infrastructure, including information infrastructure and integration infrastructure. With the development of computing power, data and the Internet, AI is at the node of changing from quantity to quality, especially at the edge. Gartner predicts that by 2025, at least 75% of data processing will be conducted outside the cloud or data center. The tide of artificial intelligence is both an opportunity and a challenge for semiconductor enterprises. Different from the cloud, the most important demand for chips on the edge side still returns to the eternal topic of performance, cost and power consumption, and the product can only win if it is provided at the same time. In addition, because the development cycle of edge AI products is short and the iteration window is fast, a friendly development environment is also critical.
The constantly developing interconnected systems in the information infrastructure, such as smart factories, smart homes, medical services and advanced driving assistance systems (ADAS), need to rely on artificial intelligence (AI) to adapt to changing situations or environments. AI provides new functions for sensing applications of robots and automotive systems. These functions use machine vision, edge computing and sensor fusion technologies to quickly sense and process data, and transmit the data to the rest of the system.
The embedded processing product series provided by Huashu includes devices supporting edge AI, which are suitable for localization decision-making, machine learning and real-time networks that can be easily deployed. A full range of analog products are available for all applications supporting AI technology. By enabling smart home applications to achieve low power consumption, medical, motor driven and intelligent factory applications can achieve high integration, high signal integrity and high efficiency.