{"id":7965,"date":"2023-07-17T14:56:02","date_gmt":"2023-07-17T06:56:02","guid":{"rendered":"https:\/\/www.huashu-tech.com\/?p=7965"},"modified":"2023-07-17T14:56:03","modified_gmt":"2023-07-17T06:56:03","slug":"nanowire-bridging-transistors-open-way-to-next-generation-electronics","status":"publish","type":"post","link":"https:\/\/www.huashu-tech.com\/fr\/nanowire-bridging-transistors-open-way-to-next-generation-electronics\/","title":{"rendered":"Les transistors de pontage \u00e0 nanofils ouvrent la voie \u00e0 l'\u00e9lectronique de nouvelle g\u00e9n\u00e9ration"},"content":{"rendered":"

A new approach to integrated circuits, combining atoms of semiconductor materials into nanowires and structures on top of silicon surfaces, shows promise for a new generation of fast, robust electronic and photonic devices. Engineers at the University of California, Davis, have recently demonstrated three-dimensional nanowire transistors using this approach that open exciting opportunities for integrating other semiconductors, such as gallium nitride, on silicon substrates.<\/p>\n

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“Silicon can’t do everything,” said Saif Islam, professor of electrical and computer engineering at UC Davis. Circuits built on conventionally etched silicon have reached their lower size limit, which restricts operation speed and integration density. Additionally, conventional silicon circuits cannot function at temperatures above 250 degrees Celsius (about 480 degrees Fahrenheit), or handle high power or voltages, or optical applications.<\/p>\n

The new technology could be used, for example, to build sensors that can operate under high temperatures, for example inside aircraft engines.<\/p>\n

“In the foreseeable future, society will be dependent on a variety of sensors and control systems that operate in extreme environments, such as motor vehicles, boats, airplanes, terrestrial oil and ore extraction, rockets, spacecraft, and bodily implants,” Islam said.<\/p>\n

Devices that include both silicon and nonsilicon materials offer higher speeds and more robust performance. Conventional microcircuits are formed from etched layers of silicon and insulators, but it’s difficult to grow nonsilicon materials as layers over silicon because of incompatibilities in crystal structure (or “lattice mismatch”) and differences in thermal properties.<\/p>\n

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